Key Features

• Precision GLAD Capability: Equipped with a high-accuracy tilting stage to achieve extreme glancing angles, allowing for the creation of porous and anisotropic nanostructures.

• Integrated Thermal Management: 

  • Active Cooling: Prevents thermal damage to sensitive substrates and allows for rapid process cycling and controlled morphology.

• Substrate Heating: High-temperature uniformity for enhanced crystallinity and thin-film quality.

• High-Performance E-Beam Source: Multi-pocket electron beam source for sequential or co-deposition of various metals, oxides, and dielectric materials.

• Advanced Motion Control: Synchronized rotation and tilting movements to ensure uniform film thickness and reproducible nanostructure growth.

• UHV Optimized: Designed for ultra-high vacuum environments to ensure high-purity deposition and minimize contamination.