제품소개

진공 기술의 정점, 반도체 R&D의 가치를 더하다
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PLD/Sputter

레이저 또는 플라즈마 에너지를 활용하여
고품질의 다성분계 산화물 및 금속 박막을 효율적으로 성장시키는 박막 제조 장비입니다.

제목Off Axis Magnetron Sputtering System2026-01-31 12:04
작성자 Level 10

An Off-axis Sputtering System with the specific configuration you described high-temperature heating (up to 800°C), dual angle-adjustable side guns, and four bottom-mounted guns is a sophisticated R&D tool designed for complex thin-film synthesis.

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  • High-Temperature Epitaxy: The substrate heater reaching over 800°C allows for the growth of high-quality crystalline films, such as complex oxides, superconductors (YBCO), or ferroelectrics, which require significant thermal energy for surface diffusion.
  • Minimized Plasma Damage: The Off-axis geometry (side-mounted guns) ensures that the substrate is not directly bombarded by high-energy oxygen anions or neutralized argon atoms. This prevents "re-sputtering" and maintains precise stoichiometry.
  • Angle-Adjustable Versatility: The side-mounted guns feature adjustable tilt angles, allowing users to optimize the deposition rate and uniformity based on the specific distance and target material.
  • Multi-Layer & Co-Sputtering: With 6 total sputter guns (2 off-axis, 4 on-axis), the system can deposit complex multi-layer heterostructures or perform co-sputtering to create new alloys and compounds without breaking vacuum.
  • Substrate Stage (Top):
    • Equipped with a high-performance Inconel holder with SiC heater capable of 800℃.
      >800
    • Often includes a rotation mechanism to ensure thickness uniformity across the wafer.
  • Off-axis Sputter Guns (Chamber Sides):
    • Two guns mounted at the side of the chamber.
    • Equipped with flexible bellows or tilting mounts to adjust the angle relative to the substrate .
    • Typically used for the primary functional layers where stoichiometry is critical.
  • On-axis Sputter Guns (Bottom):
    • Four guns arranged at the base of the chamber facing upward (Up-sputtering).
    • Used for high-rate deposition, buffer layers, or metal electrodes where direct plasma exposure is less detrimental.
  • Vacuum & Gas Control:
    • High-vacuum environment maintained by a Turbo Molecular Pump (TMP).
    • Precision Mass Flow Controllers (MFCs) for Ar, O2, or N2 to enable Reactive Sputtering.
      N to enable Reactive Sputtering.


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