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PLD/Sputter

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제목UHV Magnetron Sputtering System2026-01-31 11:43
작성자 Level 10
An Ultra-High Vacuum (UHV) sputtering system equipped with a high-temperature substrate heater (>800℃) 
and angle-adjustable sputter guns is a specialized physical vapor deposition (PVD) tool designed for depositing high-purity, epitaxial, or complex compound thin films. 

 UHV sputter.png

sputter heating test.jpg

스퍼터링소스.jpg


 

  • Ultra-High Vacuum Environment: Typically achieves a base pressure in the range of
    1
    10 to the negative 11 power
    10E-9 to 10E-10 Torr, minimizing contamination for pure film growth.
  • High-Temperature Substrate Heating: The substrate holder can heat substrates up to 800°C–1000°C, often using resistive (e.g., SiC) or lamp (e.g., quartz halogen) heaters to enable crystalline film growth.
  • Adjustable Sputter Guns (Cathodes): Magnetron guns are often mounted on tilting mechanisms or bellows, allowing users to adjust the angle of incidence 40 degree




    to optimize film structure and coverage.
  • Confocal Sputtering Configuration: Guns are arranged around the chamber in a confocal manner, allowing for on-axis, off-axis, or glancing angle sputtering, and co-sputtering.
  • Load-Lock Chamber: Enables sample transfer without breaking the UHV in the main chamber, increasing efficiency and maintaining purity. 

  • UHV Chamber: Cylindrical stainless steel chamber, typically electro-polished and bakeable, fitted with ConFlat (CF) flanges for sealing.
  • High-Temperature Substrate Manipulator:
    • Heater Assembly: Stainless steel ( Optional Molybdenum or Tantalum) heater cases holding ceramic/SiC elements.
    • Motion Control: Z-motion (vertical height adjustment) and rotation (for uniformity).
    • Biasing: Optional DC/RF bias capability for plasma cleaning or ion-assisted deposition.
  • Angle-Adjustable Magnetron Sputtering Guns:
    • Tilting Mechanism: Mechanical adjustment for angle, often including bellows to maintain vacuum seal while moving.
    • Magnet Assembly: Removable/adjustable magnets to handle both ferromagnetic and non-ferromagnetic targets.
  • Vacuum Pumping System: A combination of Turbomolecular Pump (TMP) and ( Optional Ion/Cryo pumps) is used to reach and maintain UHV.
  • Gas Delivery System: Mass Flow Controllers (MFCs) for precise Argon (sputtering gas) and reactive gases (e.g. O2, N2 etc.)

  • Shutters: Pneumatic or manual shutters for each sputter gun to prevent cross-contamination. 




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    이전Off Axis Magnetron Sputtering System Level 102026-01-31
    다음Pulsed Laser Deposition (PLD) System Level 102026-01-23
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